System-on-Foil platform
Semiconductor PackagingThe System-on-Foil platform is designed to replace traditional organic and glass substrates with innovative metal-core substrates, enhancing the thermal management and performance capabilities of electronic systems. This product utilizes advanced technologies and engineering to deliver superior results in demanding applications.
- High thermal conductivity (up to 100 times greater than glass)
- Low loss interconnects for advanced millimeter-wave RF applications
- Patented Coaxial Through Metal Vias technology for exceptional electromagnetic shielding and power delivery
- Compatibility with 3D System-in-Package architectures for efficient heat dissipation