$6.2M
+$6.2M this year1 filing since 2026 · latest Equity filed
DeepWeave builds AI-native semiconductor design optimization software. Its DeepWeave Loom platform applies machine learning and holistic design-technology co-optimization to backend IC design, improving power, performance, and area (PPA) instead of optimizing individual design steps one at a time. The product plugs into existing EDA toolchains and process design kits, and it is live with design partners. DeepWeave raised a pre-seed round led by Root Ventures.
What sets it apart
Optimizes backend chip design holistically for better PPA outcomes rather than just speeding up design, and fits into existing EDA workflows without requiring workflow changes. It is led by an ex-Google engineering leader and a UT Austin EDA professor.
A backend IC design optimization platform that uses AI-driven, holistic design-technology co-optimization to generate chip designs with improved power, performance, and area.
